OPµS (Optique et microsystèmes, SA) is specialized in designing and manufacturing scientific instrumentation and technological devices dedicated to high precision microsystems assembly and flip chip interconnects.In this context, OPµS offers advanced and performant solutions for innovative optical measurement techniques and soldering processes, adapted to:

• MEMS assembly
• MicroOptics assembly
• ±1µm flip chip bonding
• ±1µm pick and place and die attach operations.

The OPµS machines are particularly adapted to the bonding of delicate optoelectronic components such as laser diodes, diode arrays or VECSEL.

courtesy of IMC s

SYSMELEC and OPµS have concluded a joint venture in 1998 in order to unite their competences in the conception and the manufacturing of equipement specifically for the optoelectronic industry. http:// www.sysmelec.ch

OPµS and SYSMELEC are presenting a new concept for high precision Flip Chip bonding. The OptoBonder bonding head from Opµs , used in Opµs Model 100 and 200 semi automatic Flip Chip equipment for optoelectronics components, is fully compatible with SYSMELEC's Microsystems assembler SMA 1000.

Flip Chip assembling is done under permanent force and vision control The new concept allows unrivalled placement accuracy and throughput, and is completed by peripheral equipment integrated in Opµs machines or SYSMELEC's assembly lines : SYSMELEC's chip flipper or Opµs rapid eutectic soldering oven ''ReSolVE'', which unique design performs flux less soldering of optoelectronic devices.

SYSMELEC's fully automatic flip chip bonder can be linked to SYSMELEC's SMA1000 optical fibber and micro optics assembly cell to build complete photonic packaging solutions.

courtesy of Alcatel Optronics