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	<title>Automation industry: achievements applied to semiconductors - OPµS</title>
	<atom:link href="https://www.optique-microsystemes.com/en/portfolio-category/semiconductors/feed/" rel="self" type="application/rss+xml" />
	<link>https://www.optique-microsystemes.com/en/portfolio-category/semiconductors/</link>
	<description>Optical systems, high precision robots, automation</description>
	<lastBuildDate>Tue, 09 Mar 2021 08:28:49 +0000</lastBuildDate>
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	<item>
		<title>Vacuum thermocompression machine</title>
		<link>https://www.optique-microsystemes.com/en/achievements/vacuum-thermocompression-machine/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/vacuum-thermocompression-machine/#respond</comments>
		
		<dc:creator><![CDATA[Thomas BURRY]]></dc:creator>
		<pubDate>Fri, 05 Mar 2021 13:12:37 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/vacuum-thermocompression-machine/</guid>

					<description><![CDATA[<p>Vacuum thermocompression machine for the semiconductor industry. Clean room, anhydrous and ESD design Protection by automatic door with intelligent restart (automatic process recovery) PC base with Objectis Machine touch interface Inputs-outputs and axis controllers on EtherCAT, Profibus, RS232 fieldbuses Fully digital 125-ton electric compression system with closed-loop control by force sensor Distribution of forces by&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/vacuum-thermocompression-machine/" title="Read Vacuum thermocompression machine">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/vacuum-thermocompression-machine/">Vacuum thermocompression machine</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Vacuum thermocompression machine for the semiconductor industry.</p>
<ul>
<li>Clean room, anhydrous and ESD design</li>
<li>Protection by automatic door with intelligent restart (automatic process recovery)</li>
<li>PC base with Objectis Machine touch interface</li>
<li>Inputs-outputs and axis controllers on EtherCAT, Profibus, RS232 fieldbuses</li>
<li>Fully digital 125-ton electric compression system with closed-loop control by force sensor</li>
<li>Distribution of forces by ball joint system on compressed air for alignment, lockable by vacuum</li>
<li>Vacuum control and management by Pfeiffer digital controller, with partial pressure gas injection system</li>
<li>Thermal management by Eurotherm multi-loop controller on Profibus</li>
<li>Heating principle achieved by infrared radiation through transparent material and reflectors</li>
<li>Real-time visualization and recording of process parameters (forces, positions, temperatures, etc.)</li>
<li>Motion safety entirely controlled by software (Safety over EtherCAT) with controlled stops</li>
<li>Different access levels with maintenance key</li>
<li>Continuous recording of process data and generation of control reports for each assembly</li>
<li>Intelligent machine monitoring routines to reduce operational downtime</li>
<li>Rotary, tilting and height adjustable HMI</li>
<li>Clear and measured workstation lighting</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/vacuum-thermocompression-machine/">Vacuum thermocompression machine</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			</item>
		<item>
		<title>Automatic component pick &#038; place machine</title>
		<link>https://www.optique-microsystemes.com/en/achievements/pick-place-machine-for-electronic-industry/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/pick-place-machine-for-electronic-industry/#respond</comments>
		
		<dc:creator><![CDATA[Thomas BURRY]]></dc:creator>
		<pubDate>Fri, 05 Mar 2021 09:22:32 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/pick-place-machine-for-electronic-industry/</guid>

					<description><![CDATA[<p>Automatic component pick &#38; place machine for the semiconductor industry. Clean room, anhydrous and ESD design Protection by automatic door with intelligent restart (automatic process recovery) PC base with Objectis Machine touch interface Vision based on Cognex VisionPro Inputs / outputs and axis controllers on EtherCAT fieldbus Two linear motor robots (3 and 4 axes)&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/pick-place-machine-for-electronic-industry/" title="Read Automatic component pick &#38; place machine">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/pick-place-machine-for-electronic-industry/">Automatic component pick &amp; place machine</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Automatic component pick &amp; place machine for the semiconductor industry.</p>
<ul>
<li>Clean room, anhydrous and ESD design</li>
<li>Protection by automatic door with intelligent restart (automatic process recovery)</li>
<li>PC base with Objectis Machine touch interface</li>
<li>Vision based on Cognex VisionPro</li>
<li>Inputs / outputs and axis controllers on EtherCAT fieldbus</li>
<li>Two linear motor robots (3 and 4 axes) working in parallel with integrated anti-collision software module</li>
<li>Six cameras for real-time process control:
<ul>
<li>Three cameras for identifying incoming products, with polarized filters to avoid metallic reflections</li>
<li>Two cameras with telecentric lenses on the placement robot for component alignment</li>
<li>One line-scan camera with telecentric lens and on-the-fly recording, driven by the placement axis encoder, for component control before placement</li>
</ul>
</li>
<li>Real-time visualization and recording of process parameters (forces, positions, images, etc.)</li>
<li>Motion safety entirely controlled by software (Safety over EtherCAT) with controlled stops</li>
<li>Different access levels with maintenance key</li>
<li>Continuous recording of process data and generation of control reports for each assembly</li>
<li>Intelligent machine monitoring routines to reduce operational downtime</li>
<li>Rotary, tilting and height adjustable HMI</li>
<li>Clear and measured workstation lighting</li>
</ul>
<p>&nbsp;</p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/pick-place-machine-for-electronic-industry/">Automatic component pick &amp; place machine</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			</item>
		<item>
		<title>C10 Bonder: printer head bonding</title>
		<link>https://www.optique-microsystemes.com/en/achievements/c10-bonder-printer-head-bonding/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/c10-bonder-printer-head-bonding/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:18:36 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/c10-bonder-printer-head-bonding/</guid>

					<description><![CDATA[<p>The ruggedized and enhanced version of the AU Bonder for mass production, dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads. Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-outputs and thermal controller on fieldbuses (Profibus&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/c10-bonder-printer-head-bonding/" title="Read C10 Bonder: printer head bonding">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/c10-bonder-printer-head-bonding/">C10 Bonder: printer head bonding</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>The ruggedized and enhanced version of the AU Bonder for mass production, dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads.</p>
<ul>
<li>Cleanroom and ESD design.</li>
<li>Protection by light curtain with smart restart (process recovery).</li>
<li>PC based with touch interface.</li>
<li>Inputs-outputs and thermal controller on fieldbuses (Profibus and EtherCAT).</li>
<li>Brushless motor with Galil axis control card, closed control loops for position and force.</li>
<li>Visualization and real-time recording of process parameters (strength, positions, temperatures &#8230;).</li>
<li>Different levels of access with maintenance key.</li>
<li>Modular architecture allows the future integration of a second assembly station</li>
<li>Adjustable laminar flows integration on roof.</li>
<li>Fumes extraction through the assembly module.</li>
<li>Barcode reader for production monitoring.</li>
<li>Live saving of process data and report generation for each part.</li>
<li>Intelligent condition monitoring routines to reduce operational downtimes.</li>
<li>Rotatable, tiltable and height adjustable HMI.</li>
<li>Smooth, bright and measured lighting.</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/c10-bonder-printer-head-bonding/">C10 Bonder: printer head bonding</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			</item>
		<item>
		<title>WDoD stacker</title>
		<link>https://www.optique-microsystemes.com/en/achievements/wdod-stacker/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/wdod-stacker/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:15:02 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/wdod-stacker/</guid>

					<description><![CDATA[<p>Silicon wafer assembling and bonding machine.</p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/wdod-stacker/">WDoD stacker</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Silicon wafer assembling and bonding machine.</p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/wdod-stacker/">WDoD stacker</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Thermal compression oven under vacuum</title>
		<link>https://www.optique-microsystemes.com/en/achievements/thermal-compression-oven-under-vacuum/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/thermal-compression-oven-under-vacuum/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:14:00 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/thermal-compression-oven-under-vacuum/</guid>

					<description><![CDATA[<p>Chamber allowing the compression under vacuum of elements up to 800°C and 100Mpa during 1min30. Heating using light radiation for a quick temperature rise (more or less 100°C per minute). Water cooling of the chamber and the sealing rings. System mounted under a compressed air spherical bearing to guarantee pressure uniformity. Special reflective treatment on&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/thermal-compression-oven-under-vacuum/" title="Read Thermal compression oven under vacuum">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/thermal-compression-oven-under-vacuum/">Thermal compression oven under vacuum</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Chamber allowing the compression under vacuum of elements up to 800°C and 100Mpa during 1min30.</p>
<ul>
<li>Heating using light radiation for a quick temperature rise (more or less 100°C per minute).</li>
<li>Water cooling of the chamber and the sealing rings.</li>
<li>System mounted under a compressed air spherical bearing to guarantee pressure uniformity.</li>
<li>Special reflective treatment on the enclosure to avoid heat build-up.</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/thermal-compression-oven-under-vacuum/">Thermal compression oven under vacuum</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>CsI Cut: X-ray scintillator cutter</title>
		<link>https://www.optique-microsystemes.com/en/achievements/csi-cut-x-ray-scintillator-cutter/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/csi-cut-x-ray-scintillator-cutter/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:10:16 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/csi-cut-x-ray-scintillator-cutter/</guid>

					<description><![CDATA[<p>Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-Outputs on fieldbus (EtherCAT). Brushless motors with Galil axis control card, closed control loops for position and force. Visualization and real-time recording of process parameters (strength, positions, temperatures &#8230;). Automatic recipe selection with barcode reader. Product final&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/csi-cut-x-ray-scintillator-cutter/" title="Read CsI Cut: X-ray scintillator cutter">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/csi-cut-x-ray-scintillator-cutter/">CsI Cut: X-ray scintillator cutter</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<ul>
<li>Cleanroom and ESD design.</li>
<li>Protection by light curtain with smart restart (process recovery).</li>
<li>PC based with touch interface.</li>
<li>Inputs-Outputs on fieldbus (EtherCAT).</li>
<li>Brushless motors with Galil axis control card, closed control loops for position and force.</li>
<li>Visualization and real-time recording of process parameters (strength, positions, temperatures &#8230;).</li>
<li>Automatic recipe selection with barcode reader.</li>
<li>Product final control by vision and control report generation.</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/csi-cut-x-ray-scintillator-cutter/">CsI Cut: X-ray scintillator cutter</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			</item>
		<item>
		<title>AU Bonder: printer head bonding</title>
		<link>https://www.optique-microsystemes.com/en/achievements/au-bonder-printer-head-bonding/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/au-bonder-printer-head-bonding/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:09:54 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/au-bonder-printer-head-bonding/</guid>

					<description><![CDATA[<p>Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads. Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-outputs and thermal controller on fieldbuses (Profibus and EtherCAT). Brushless motor with Galil axis control card, closed control&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/au-bonder-printer-head-bonding/" title="Read AU Bonder: printer head bonding">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/au-bonder-printer-head-bonding/">AU Bonder: printer head bonding</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads.</p>
<ul>
<li>Cleanroom and ESD design.</li>
<li>Protection by light curtain with smart restart (process recovery).</li>
<li>PC based with touch interface.</li>
<li>Inputs-outputs and thermal controller on fieldbuses (Profibus and EtherCAT).</li>
<li>Brushless motor with Galil axis control card, closed control loops for position and force.</li>
<li>Visualization and real-time recording of process parameters (strength, positions, temperatures &#8230;).</li>
<li>Different levels of access with maintenance key.</li>
<li>Modular architecture allows the future integration of a second assembly station.</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/au-bonder-printer-head-bonding/">AU Bonder: printer head bonding</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>MEMS / MOEMS</title>
		<link>https://www.optique-microsystemes.com/en/achievements/mems-moems/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/mems-moems/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:04:34 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/mems-moems/</guid>

					<description><![CDATA[<p>OptoBonder machine range for flip chip bonding. The OptoBonders offer a full range of assembly processes: thermal local bonding with pulsed heating of the component, neutral or active atmosphere bonding and vacuum reflux bonding. The OptoBonder assembly units offer unparalleled precision and speed for assembly by flip chip sensitive optoelectronic components such as laser diodes,&#8230; <a class="read-more" href="https://www.optique-microsystemes.com/en/achievements/mems-moems/" title="Read MEMS / MOEMS">Read more &#187;</a></p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/mems-moems/">MEMS / MOEMS</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<p>OptoBonder machine range for flip chip bonding. The OptoBonders offer a full range of assembly processes: thermal local bonding with pulsed heating of the component, neutral or active atmosphere bonding and vacuum reflux bonding.</p>
<p>The OptoBonder assembly units offer unparalleled precision and speed for assembly by flip chip sensitive optoelectronic components such as laser diodes, arrays of diodes or VECSEL.</p>
<p>The OptoBonders are designed to be used in semi-automatic mode and can be integrated into a fully automatic line SMA (in partnership with Unitechnologies).</p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/mems-moems/">MEMS / MOEMS</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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			</item>
		<item>
		<title>Other achievements in the field of semiconductors</title>
		<link>https://www.optique-microsystemes.com/en/achievements/other-achievements-in-the-field-of-semiconductors/</link>
					<comments>https://www.optique-microsystemes.com/en/achievements/other-achievements-in-the-field-of-semiconductors/#respond</comments>
		
		<dc:creator><![CDATA[Charles DEVILLIERS]]></dc:creator>
		<pubDate>Wed, 03 Feb 2021 09:00:41 +0000</pubDate>
				<guid isPermaLink="false">https://www.optique-microsystemes.com/portfolio/other-achievements-in-the-field-of-semiconductors/</guid>

					<description><![CDATA[<p>Thermode: pulsed heating module for drying epoxy or eutectic mixture reflux. ReSolVE: Reflow Soldering Vacuum Enclosure: solder room (with or without flux) without inclusion for optoelectronic components.</p>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/other-achievements-in-the-field-of-semiconductors/">Other achievements in the field of semiconductors</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></description>
										<content:encoded><![CDATA[<ul>
<li>Thermode: pulsed heating module for drying epoxy or eutectic mixture reflux.</li>
<li>ReSolVE: Reflow Soldering Vacuum Enclosure: solder room (with or without flux) without inclusion for optoelectronic components.</li>
</ul>
<p>L’article <a href="https://www.optique-microsystemes.com/en/achievements/other-achievements-in-the-field-of-semiconductors/">Other achievements in the field of semiconductors</a> est apparu en premier sur <a href="https://www.optique-microsystemes.com/en/">OPµS</a>.</p>
]]></content:encoded>
					
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