MEMS / MOEMS
OptoBonder machine range for flip chip bonding. The OptoBonders offer a full range of assembly processes: thermal local bonding with pulsed heating of the component, neutral or active atmosphere bonding and vacuum reflux bonding.
The OptoBonder assembly units offer unparalleled precision and speed for assembly by flip chip sensitive optoelectronic components such as laser diodes, arrays of diodes or VECSEL.
The OptoBonders are designed to be used in semi-automatic mode and can be integrated into a fully automatic line SMA (in partnership with Unitechnologies).