AU Bonder: printer head bonding
Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads.
- Cleanroom and ESD design.
- Protection by light curtain with smart restart (process recovery).
- PC based with touch interface.
- Inputs-outputs and thermal controller on fieldbuses (Profibus and EtherCAT).
- Brushless motor with Galil axis control card, closed control loops for position and force.
- Visualization and real-time recording of process parameters (strength, positions, temperatures …).
- Different levels of access with maintenance key.
- Modular architecture allows the future integration of a second assembly station.