Vacuum thermocompression machine for the semiconductor industry. Clean room, anhydrous and ESD design Protection by automatic door with intelligent restart (automatic process recovery) PC base with Objectis Machine touch interface Inputs-outputs and axis controllers on EtherCAT, Profibus, RS232 fieldbuses Fully digital 125-ton electric compression system with closed-loop control by force sensor Distribution of forces by… Read more »
Automatic component pick & place machine for the semiconductor industry. Clean room, anhydrous and ESD design Protection by automatic door with intelligent restart (automatic process recovery) PC base with Objectis Machine touch interface Vision based on Cognex VisionPro Inputs / outputs and axis controllers on EtherCAT fieldbus Two linear motor robots (3 and 4 axes)… Read more »
The ruggedized and enhanced version of the AU Bonder for mass production, dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads. Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-outputs and thermal controller on fieldbuses (Profibus… Read more »
Silicon wafer assembling and bonding machine.
Chamber allowing the compression under vacuum of elements up to 800°C and 100Mpa during 1min30. Heating using light radiation for a quick temperature rise (more or less 100°C per minute). Water cooling of the chamber and the sealing rings. System mounted under a compressed air spherical bearing to guarantee pressure uniformity. Special reflective treatment on… Read more »
Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-Outputs on fieldbus (EtherCAT). Brushless motors with Galil axis control card, closed control loops for position and force. Visualization and real-time recording of process parameters (strength, positions, temperatures …). Automatic recipe selection with barcode reader. Product final… Read more »
Machine dedicated to the piezoelectric assembly on a ceramic substrate used in the manufacture of industrial plotters print heads. Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-outputs and thermal controller on fieldbuses (Profibus and EtherCAT). Brushless motor with Galil axis control card, closed control… Read more »
OptoBonder machine range for flip chip bonding. The OptoBonders offer a full range of assembly processes: thermal local bonding with pulsed heating of the component, neutral or active atmosphere bonding and vacuum reflux bonding. The OptoBonder assembly units offer unparalleled precision and speed for assembly by flip chip sensitive optoelectronic components such as laser diodes,… Read more »
Thermode: pulsed heating module for drying epoxy or eutectic mixture reflux. ReSolVE: Reflow Soldering Vacuum Enclosure: solder room (with or without flux) without inclusion for optoelectronic components.