Category name: Semiconductors

Vacuum thermocompression machine

Vacuum thermocompression machine for the semiconductor industry. Clean room, anhydrous and ESD design Protection by automatic door with intelligent restart (automatic process recovery) PC base with Objectis Machine touch interface Inputs-outputs and axis controllers on EtherCAT, Profibus, RS232 fieldbuses Fully digital 125-ton electric compression system with closed-loop control by force sensor Distribution of forces by… Read more »

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CsI Cut: X-ray scintillator cutter

Cleanroom and ESD design. Protection by light curtain with smart restart (process recovery). PC based with touch interface. Inputs-Outputs on fieldbus (EtherCAT). Brushless motors with Galil axis control card, closed control loops for position and force. Visualization and real-time recording of process parameters (strength, positions, temperatures …). Automatic recipe selection with barcode reader. Product final… Read more »

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OptoBonder machine range for flip chip bonding. The OptoBonders offer a full range of assembly processes: thermal local bonding with pulsed heating of the component, neutral or active atmosphere bonding and vacuum reflux bonding. The OptoBonder assembly units offer unparalleled precision and speed for assembly by flip chip sensitive optoelectronic components such as laser diodes,… Read more »

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